Technologies for cofabricating MEMS and electronics
Technologies for cofabricating MEMS and electronics
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DOI：
10.1109/jproc.2007.911064
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发表时间：
2008-02-01
影响因子：
20.6
通讯作者：
Quevy, Emmanuel P.
中科院分区：
文献类型：
--
作者：
Fedder, Gary K.;Howe, Roger T.;Quevy, Emmanuel P.
最初为集成电子器件开发的微加工技术已成功应用于批量制造各种微机械结构，用于传感、驱动或信号处理功能（例如滤波器）。通过将微机电器件的沉积、蚀刻和光刻步骤与微电子器件所需的步骤适当地结合起来，可以在单个工艺序列中制造集成微系统。本文回顾了共制造的策略，重点是不混合两种工艺顺序的模块化方法。使用物理传感器（红外成像仪和惯性传感器）、化学和生化传感器、用于显示器和光学开关的静电和热致动器以及非易失性存储器的示例来讨论集成过程。通过向集成电子器件添加新功能，微机电系统的使用正在开辟传感和驱动领域的新应用，并提高模拟和数字集成电路的性能。
Microfabrication technologies initially developed for integrated electronics have been successfully applied to batch-fabricate a wide variety of micromechanical structures for sensing, actuating, or signal-processing functions such as filters. By appropriately combining the deposition, etching, and lithography steps for microelectromechanical devices with those needed for microelectronic devices, it is possible to fabricate an integrated microsystern in a single process sequence. This paper reviews the strategies for cofabrication, with an emphasis on modular approaches that do not mix the two process sequences. The integrated processes are discussed using examples of physical sensors (infrared imagers and inertial sensors), chemical and biochemical sensors, electrostatic and thermal actuators for displays and optical switching, and nonvolatile memories. By adding new functionality to integrated electronics, the use of microelectromechanical systems is opening new applications in sensing and actuating, as well as enhancing the performance of analog and digital integrated circuits.