Parallel optical interconnect between ceramic BGA packages on FR4 board using embedded waveguides and passive optical alignments
Parallel optical interconnect between ceramic BGA packages on FR4 board using embedded waveguides and passive optical alignments
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使用嵌入式波导和无源光学对准在 FR4 板上的陶瓷 BGA 封装之间实现并行光学互连
DOI：
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发表时间：
2006
期刊：
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通讯作者：
J. Kivilahti
中科院分区：
文献类型：
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作者：
M. Karppinen;T. Alajoki;A. Tanskanen;K. Kataja;Jukka;K. Kautio;P. Karioja;M. Immonen;J. Kivilahti
我们已经研究了使用板嵌入式聚合物波导和表面安装组件封装或模块在印刷电路板（PCB）上设计和制造高比特率芯片到芯片光学互连的技术。为了展示所开发的技术，4倍10 Gb/s的光互连完全集成在标准FR 4 PCB上。光链路演示器由4通道BGA安装的发射器和接收器模块以及四个平行的多模光波导组成，这些多模光波导使用光刻图案制作在PCB的焊接掩模顶部。发射机和接收机采用低温共烧陶瓷（LTCC）基片，包括4 × 10 Gb/s倒装VCSEL或光电二极管阵列、引线键合驱动器和接收器集成电路以及光耦合结构。两个微透镜阵列和一个微反射镜实现了光电器件和波导阵列之间的光学耦合。被动光学对准基于LTCC工艺和光学层图案化中制造的标记和结构。表征的光学对准公差在表面贴装技术的精度范围内。所演示的技术适用于CBGA封装的IC或多芯片模块的互连
We have studied technologies to design and fabricate high-bit-rate chip-to-chip optical interconnects on printed circuit boards (PCBs) using board-embedded polymer waveguides and surface-mounted component packages or modules. In order to demonstrate the developed technologies, a 4times10 Gb/s optical interconnect was completely integrated on a standard FR4 PCB. The optical link demonstrator consists of 4-channel BGA-mounted transmitter and receiver modules as well as of four parallel multimode optical waveguides fabricated on top of the solder mask of the PCB using lithographic patterning. The transmitters and receivers built on low-temperature co-fired ceramic (LTCC) substrates include 4times10 Gb/s flip-chip mounted VCSEL or photodiode array, wire-bonded driver and receiver ICs, and optical coupling structures. Two microlens arrays and a micro-mirror enable optical coupling between the optoelectronic devices and the waveguide array. The passive optical alignment was based on the marks and structures fabricated both in the LTCC process and in the patterning of the optical layers. The characterized optical alignment tolerances are in the limits of accuracy of the surface-mount technology. The demonstrated technology is suitable for interconnecting CBGA-packaged ICs or multi-chip-modules