Residual stress analysis in the film/substrate system with the effect of creep deformation
Residual stress analysis in the film/substrate system with the effect of creep deformation
复制标题
受蠕变变形影响的薄膜/基体系统中的残余应力分析
DOI:
10.1063/1.3191684
复制
发表时间:
2009-08
影响因子:
3.2
通讯作者:
Tu, Shan-Tung
中科院分区:
文献类型:
--
作者:
Chen, Qing-Qi;Xuan, Fu-Zhen;Tu, Shan-Tung
The physical phenomenon of residual stress relaxation and redistribution in the film/substrate systems due to creep deformation is focused in this work. A new analysis model to elucidate either the film or the substrate subjected to creeping deformation is developed. Specific analyses are made on the NiCrAlY coating-based system and silicon-epoxy bilayer structure. Results reveal that the proposed model can lead to an excellent agreement with the simulated results of finite element method. Furthermore, comparisons among FE results, the present model, and Zhang’s creep solution [J. Appl. Phys. 101, 083530 (2007)] have been carried out. Meanwhile, comparisons between Hsueh’s viscoelastic solution [J. Appl. Phys. 91, 2760 (2002)] and our current model in the case of creep exponent n=1 have also been conducted. Effects of thickness ratio of the film to the substrate on the stress distribution and the evolution of the accumulated creep strain have also been discussed in this paper.
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影响因子:
9.4
作者:
Rui Huang;J. Prévost;Z. Suo
通讯作者:
Rui Huang;J. Prévost;Z. Suo
影响因子:
9.4
作者:
Yu‐Lin Shen;S. Suresh
通讯作者:
Yu‐Lin Shen;S. Suresh
影响因子:
5.4
作者:
S. Bull
通讯作者:
S. Bull
影响因子:
3.2
作者:
Neng-Hui Zhang;Jingjing Xing
通讯作者:
Neng-Hui Zhang;Jingjing Xing
DOI:
10.1364/josa.11.000233
发表时间:
1925-09-01
影响因子:
--
作者:
Timoshenko, S
通讯作者:
Timoshenko, S