Interface microstructure evolution of a novel CuW/Al composite fabricated by an infiltration method
Interface microstructure evolution of a novel CuW/Al composite fabricated by an infiltration method
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渗透法制备新型 CuW/Al 复合材料的界面微观结构演化
DOI：
10.1016/j.jallcom.2019.152506
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发表时间：
2020-03
影响因子：
6.2
通讯作者：
Qiao Zhang
中科院分区：
文献类型：
--
作者：
Chan Wang;Shuhua Liang;Fei Cao;Qiao Zhang
In the present work, a novel CuW/Al composite was fabricated using an infiltration method by designing a porous W structure on the CuW surface. The evolution and growth kinetics of interfacial intermetallics compounds (IMCs) were studied. The metallurgical reaction between the CuW alloy and Al lead to the formation of five transition zones, which were layer-like, hypereutectic, eutectic, hypoeutectic and needle-like zones from the CuW side to the Al side. Three kinds of IMCs formed at the CuW/Al interface, which were identified as AlCu, Al2Cu and Al4W based on SEM, EDS and TEM analysis. In addition, the effects of temperature (690–740 °C) and holding time (10–60 min) on interfacial microstructure were investigated. The thickness of interface increased with increasing temperature and holding time. The growth kinetics of interface obeyed linear behavior and could be expressed as:y= 3.27 × 108exp (-163/RT)t. Ab-initio calculations showed that Al2Cu formed first because of the low formation enthalpy. The results provide a guide for controlling the interfacial microstructure and promote the engineering application of the novel composite.
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影响因子：
6.2
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通讯作者：
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影响因子：
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