17.1 A 0.6V 1.5GHz 84Mb SRAM design in 14nm FinFET CMOS technology
17.1 A 0.6V 1.5GHz 84Mb SRAM design in 14nm FinFET CMOS technology
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17.1 采用 14nm FinFET CMOS 技术的 0.6V 1.5GHz 84Mb SRAM 设计
DOI:
10.1109/isscc.2015.7063050
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发表时间:
2015
期刊:
影响因子:
--
通讯作者:
Kevin Zhang
中科院分区:
文献类型:
--
作者:
E. Karl;Z. Guo;James W. Conary;Jeffrey L. Miller;Yong;Satyanand Nalam;Daeyeon Kim;J. Keane;U. Bhattacharya;Kevin Zhang
The growth of battery-powered mobile and wearable devices has increased the importance of low-power operation and cost in system-on-a-chip (SoC) design. Supply-voltage scaling is the predominant approach to active power reduction for SoC design, including voltage scaling for on-die memory given increasing levels of memory integration. SRAM can limit the minimum operating voltage (VMIN) of a design, often leading to the introduction of separate voltage supplies for on-die memory. Additional supplies increase platform cost, and operating memory at higher voltage leads to increased power consumption. The introduction of trigate devices at the 22nm technology node delivered superior short channel effects and subthreshold slope relative to existing bulk planar device technology enabling reduction in threshold voltage within a fixed leakage constraint. Lower transistor Vth, improvements to random device variability, and assist circuits to overcome device-size quantization enabled a >150mV reduction in SRAM VMIN [1]. At the 14nm technology node, FinFET device-size quantization remains a challenge for compact 6T SRAM bitcells with minimum-size transistors. Careful co-optimization between technology and design of memory-assist circuits is required in order to deliver dense, low-power memory operation at low voltages. In this paper, we present an 84Mb SRAM array design with wide-voltage-range operation in a 14nm logic technology featuring 2nd-generation FinFET transistors.