Thermal Diffusion Analysis for LED Module
Thermal Diffusion Analysis for LED Module
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DOI：
10.1002/htj.20182
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发表时间：
2007-12-01
影响因子：
4.9
通讯作者：
Chen, C.
中科院分区：
文献类型：
--
作者：
Su, Ay;Liu, Y.;Chen, C.
本研究主要探讨发光二极体晶片之热特性及热基板照明之灵敏度。并对LED系统的热通量进行了最佳热扩散区域的确定。结果表明，红色LED芯片具有较低的电阻，因此具有比绿色和蓝色LED芯片低的功耗。鉴于这三种颜色的照明LED，红色LED芯片对热环境更敏感。当衬底温差增加到25摄氏度时，红色LED的照明照度降低了近12%。在相同条件下，绿色和蓝色LED芯片的发光强度仅降低2 ~ 2.5%。热扩散面积结果表明，热扩散率与LED基板温度密切相关。如果上限LED基板温度被设置为50摄氏度并且热扩散率接近72 cm（2）/w，则对于500 cm（2）的热扩散面积，其可以维持7瓦的最佳热通量。(C)2007 Wiley Periodicals，Inc.
An experimental investigation of the thermal characteristic of the LED chip and the sensitivity of illumination with thermal substrate is discussed in this study. An optimum thermal diffusion area to the heat flux of LED system is also conducted. Results show that a red LED chip has lower electrical resistance, and therefore has lower power consumption than that of green and blue LED chips. Given these three colors of lighting LEDs, the red LED chip is more sensitive to the thermal environment. A red LED's lighting illumination is decreased almost 12% when the substrate temperature difference is increased to 25 degrees C. Under the same condition, an LED's illumination experiences only a 2 to 2.5% reduction for the green and blue LED chip.Thermal diffusion area results show a close correlation between thermal diffusion ratio and LED substrate temperature. If the upper limit LED substrate temperature is set at 50 degrees C and the thermal diffusion ratio approximates 72 cm(2)/w, for a 500 cm(2) thermal diffusion area, it can sustain an optimum heat flux at 7 watts. (C) 2007 Wiley Periodicals, Inc.