Vacuum Ultraviolet Irradiation Treatment for Reducing Gold-Gold Bonding Temperature
Vacuum Ultraviolet Irradiation Treatment for Reducing Gold-Gold Bonding Temperature
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DOI：
10.2320/matertrans.mf201313
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发表时间：
2013-11-01
影响因子：
1.2
通讯作者：
Mizuno, Jun
中科院分区：
文献类型：
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作者：
Okada, Akiko;Shoji, Shuichi;Mizuno, Jun
在氧气存在下，在真空紫外照射下（VUV/O-3）实现低温Au-Au键合。通过X射线光电子能谱（XPS）和原子力显微镜（AFM）测量分析了真空紫外/O-3处理后获得的Au表面。结果表明，碳基污染物的量显着减少，并没有严重的损害Au表面所造成的真空紫外/O-3处理。真空紫外/臭氧处理后，金-金键合温度成功地降低到150摄氏度。平均剪切强度约为56 MPa，结合样品的横截面扫描电子显微镜（SEM）图像证实不存在空隙和裂纹。因此，VUV/O-3处理对于实现低温Au Au接合是高度有效的。
Low-temperature Au-Au bonding was achieved under vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O-3). The Au surfaces obtained after the VUV/O-3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) measurements. The results indicate that the amount of carbon-based contaminants was dramatically decreased and that there was no serious damage to Au surfaces caused by the VUV/O-3 treatment. The Au-Au bonding temperature was successfully reduced to 150 degrees C after the VUV/O-3 treatment. The average shear strength was approximately 56 MPa, and cross-sectional scanning electron microscopy (SEM) images of the bonded samples confirmed the absence of voids and cracks. Therefore, VUV/O-3 treatment is highly effective for achieving low-temperature Au Au bonding.