Improved Plywood Strength and Lowered Emissions from Soybean Meal/Melamine Urea-Formaldehyde Adhesives
Improved Plywood Strength and Lowered Emissions from Soybean Meal/Melamine Urea-Formaldehyde Adhesives
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DOI:
10.13073/0015-7473-61.8.688
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发表时间:
2011-12
影响因子:
0.9
通讯作者:
Q. Gao;S. Shi;Shifeng Zhang;Jianzhang Li;Kaiwen Liang
中科院分区:
文献类型:
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作者:
Q. Gao;S. Shi;Shifeng Zhang;Jianzhang Li;Kaiwen Liang
The objective of this study was to improve the wet shear strength and reduce the formaldehyde emissions for the soybean meal/melamine urea-formaldehyde (MUF) adhesive–bonded plywood by optimizing the hot pressing parameters in plywood manufacturing. An L(44) experimental design was used. A dynamic mechanical analyzer (DMA) was used to study the curing process of the adhesive during hot pressing. The DMA results showed that the storage modulus (E′) first decreased to a minimum at 72.9°C and then increased as the temperature increased to a maximum at 157.2°C. At temperatures higher than 157.2°C, the storage modulus decreased as the temperature increased. The hot press temperature had a significant effect on both the wet shear strength and the formaldehyde emissions from 120°C to 150°C, while no significant effect was found by varying the hot press time from 50 to 80 s/mm and changing the pressure from 0.8 to 1.2 MPa. The adhesive spread rate had a significant effect on the formaldehyde emissions. No signifi...