Contact mechanics and lubrication hydrodynamics of chemical mechanical polishing
Contact mechanics and lubrication hydrodynamics of chemical mechanical polishing
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DOI：
10.1149/1.1391798
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发表时间：
1999-04-01
影响因子：
3.9
通讯作者：
Danyluk, S
中科院分区：
文献类型：
--
作者：
Tichy, J;Levert, JA;Danyluk, S
建立了化学机械抛光过程的接触力学和流体力学的初步模型。只需要弹性接触面力学和流体动力润滑的基本方程。虽然模型是高度理想化的，但不需要特别的假设或可调整的参数。提出了一些新的实验结果，加强了对垫下吸力流体压力的反直觉实验测定。该模型正确地预测了吸力压力的大小以及载荷、速度和粗糙度的影响。(C) 1999电化学学会。s0013 - 4651(98) 04-081-6。版权所有。
A preliminary model for the contact mechanics and fluid mechanics of the chemical mechanical polishing process is presented. Only the basic equations of elastic contact surface mechanics and hydrodynamic lubrication are required. Although the model is highly idealized, no ad hoc assumptions or adjustable parameters are required. Some new experimental results are presented, reinforcing the counterintuitive experimental determination of suction fluid pressure below the pad. The model correctly predicts the magnitude of the suction pressure and the effect of load, speed and roughness. (C) 1999 The Electrochemical Society. S0013-4651(98)04-081-6. All rights reserved.