Lithographic Properties of Positive Photosensitive Polyimide Insulator by Block Copolymerization
Lithographic Properties of Positive Photosensitive Polyimide Insulator by Block Copolymerization
复制标题
嵌段共聚正性光敏聚酰亚胺绝缘体的光刻性能
DOI：
10.2494/photopolymer.14.61
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发表时间：
2001
影响因子：
0.8
通讯作者：
S. Matsumoto
中科院分区：
文献类型：
--
作者：
T. Itatani;M. Komuro;M. Aoyagi;B. Jung;S. Segawa;H. Itatani;M. Miyamura;S. Matsumoto
光敏聚酰亚胺作为一种介电层间材料在大规模集成电路中具有巨大的应用潜力。通过一步缩聚反应合成了嵌段共聚亚胺21-169。该过程涉及在NMP/甲苯溶剂体系中，在γ-戊内酯/吡啶催化剂存在下，在180℃下将二酐与二胺反应。该实验涉及两种类型的重氮萘醌（DNQ）化合物，称为PC-5和NT-200。用几种碱性水溶液和四甲基氢氧化铵（TMAH）对曝光的薄膜进行显影处理。发现硅烷偶联剂溶液是保证聚酰亚胺层与硅片良好粘附的必要条件。本文对所得产物在365nm波长光和700mJ/cm2下暴露区和未暴露区溶解度特性和图案形状进行了研究。完全暴露区与未暴露区对比γ值均大于1.1。PC-5光敏材料是聚酰亚胺21-169在碱性显影液（A0）中的有效溶解抑制剂。
Photosensitive polyimide has enormous potential as a future dielectric interlayer material for potential use in large scale integrated (LSI) circuits. The block copolyimide known as 21-169 was synthesised via a single step polycondensation reaction. This procedure involved reacting dianhydrides with diamines in the presence of γ- valerolactone/pyridine catalyst in a NMP/toluene solvent system at 180°C. This experimentation involves two types of diazonaphtoquinone (DNQ) compound referred to as PC-5 and NT-200. The exposed films were subjected to a developing process using several alkaline aqueous solutions and tetramethylammonium hydroxide (TMAH). A solution of silane coupling reagent was found to be necessary for good adhesion between the polyimide layer and the silicon wafer. In this paper, the resulting products solubility characteristic and pattern shape of the exposed and unexposed areas at 365nm wavelength of light and 700mJ/cm2 were investigated. The contrast γ value between the fully exposed and unexposed area was found to be above 1.1. The PC-5 photosensitive material was found to be an effective dissolution inhibitor for polyimide 21-169 in alkaline developer solution (A0).