A fractal model for predicting thermal contact conductance considering elasto-plastic deformation and base thermal resistances

A fractal model for predicting thermal contact conductance considering elasto-plastic deformation and base thermal resistances
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考虑弹塑性变形和基础热阻的预测接触热导的分形模型

DOI:
10.1007/s12206-018-1247-9
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发表时间:
2019-01
影响因子:
1.6
通讯作者:
Fang Bin
Fang Bin
中科院分区:
工程技术4区
文献类型:
--
作者:
Zhang Jinhua;Liu Yili;Yan Ke;Fang Bin

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建立了接触热导的预测模型。工程粗糙表面具有三维分形Weierstrass-Mandelbrot分形函数。考虑了完全塑性变形、弹塑性变形和弹性变形三种变形模式,分析了接触机理。将分形表面和三种变形模式引入接触热导的计算。建立了同时考虑基底热阻和收缩热阻的接触热导综合计算模型。结果表明:接触热导率随法向接触压力的增大而增大;收缩电阻分量对基底电阻分量的相对贡献随法向接触压力的增大而增大;分形维数和分形粗糙度对接触热导率均有显著影响。
A prediction model of thermal contact conductance is developed. Engineering rough surfaces are characterized by three-dimensional fractal Weierstrass-Mandelbrot fractal function. Three deformation modes, including fully plastic deformation, elasto-plastic deformation and elastic deformation, are considered to analyze the contact mechanism. Fractal surface and three deformation modes are incorporated into the calculation of thermal contact conductance. A comprehensive thermal contact conductance computation model considering both base thermal resistance and constricted thermal resistance is established. The results show that thermal contact conductance increases with the increase of normal contact pressure; the relative contribution of constricted resistance component to base resistance component tends to increase with the increase of normal contact pressure; fractal dimension and fractal roughness both have significant influences on thermal contact conductance.
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