Knee implants - Review of models and biomechanics

Knee implants - Review of models and biomechanics
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DOI:
10.1016/j.matdes.2008.03.032
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发表时间:
2009-02-01
期刊:
影响因子:
8.4
通讯作者:
Goswami, Tarun
Goswami, Tarun
中科院分区:
材料科学1区
文献类型:
--
作者:
Carr, Brandi C.;Goswami, Tarun

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自20世纪50年代以来,膝关节植入物已被设计用于替换胫股关节和髌股关节的受损软骨和骨。目前至少有150种植入物,医生和工程师的进步模拟了健康膝关节的几何形状和行为。多位研究人员对膝关节植入物组件的生物力学进行了评价,以评估某些膝关节植入物模型的性能。许多作者研究了生物力学因素,如接触应力、运动学和疲劳,以验证膝关节植入物在特定载荷条件下的质量。选择用于膝关节植入物的材料,以平衡强度要求和生物相容性要求。虽然钛(Ti)合金、钴Chrome和超高分子量聚乙烯等材料的使用改善了植入物设计,但磨损、松动和其他因素继续限制膝关节植入物的性能。已经开发了二维和三维有限元模型(FEM),其中包括人工膝关节和周围生物材料的一部分,以研究这种相互作用。有限元分析(FEA)已被用于预测种植体在各种静态和动态载荷条件下的生物力学行为。本文综述了有限元分析研究以及膝关节植入物的生物力学行为。(C)2008爱思唯尔有限公司保留所有权利。
Since the 1950s, knee implants have been designed to replace damaged cartilage and bone of the tibio-femoral and patellofemoral joints. At least 150 implants exist today, with advancements by physicians and engineers that simulate the geometry and behavior of a healthy knee joint. Various researchers have evaluated the biomechanics of knee implant components to assess the performance of some of the knee implant models. Many authors have investigated biomechanical factors such as contact stresses, kinematics and fatigue to validate the quality of knee implants under specific loading conditions. Materials used for knee implants are selected to balance strength requirements with biocompatibility needs. While use of materials such as titanium (Ti) alloys, cobalt chrome and ultra-high molecular weight polyethylene have led to improved implant designs, wear, loosening and other factors continue to limit the performance of knee implants. Two- and three-dimensional finite element models (FEMs) have been developed which include the artificial knee and portions of the surrounding biological materials to investigate this interaction. Finite element analysis (FEA) has been used to predict implant biomechanical behavior under various static and dynamic loading conditions. This paper reviews FEA studies as well as the biomechanical behavior of knee implants. (C) 2008 Elsevier Ltd. All rights reserved.