New contacting technique for thin film resistance measurements perpendicular to the film plane
New contacting technique for thin film resistance measurements perpendicular to the film plane
复制标题
用于垂直于薄膜平面的薄膜电阻测量的新型接触技术
DOI:
10.1063/1.109730
复制
发表时间:
1993
期刊:
影响因子:
--
通讯作者:
H. Janssen
中科院分区:
文献类型:
--
作者:
M. Gijs;J. Giesbers;S. Lenczowski;H. Janssen
Using microlithography, we have fabricated Au thin film structures for resistance measurements with current directed perpendicular to the film plane. We propose a novel contact geometry for accurate measurement of the very low metallic perpendicular resistance, which prevents any disturbing influence from the much larger resistance of the contact leads. Our experimental results are well explained by a classical model and our interpretation is independently confirmed by a three‐dimensional electrostatic calculation based on the finite element method.