Thermal conductivity of polyamide 12 powder for use in laser sintering
Thermal conductivity of polyamide 12 powder for use in laser sintering
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用于激光烧结的聚酰胺12粉末的导热性
DOI：
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发表时间：
2013
期刊：
影响因子：
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通讯作者：
J. Beaman
中科院分区：
文献类型：
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作者：
Mengqi Yuan;T. Diller;D. Bourell;J. Beaman
目的——本文的目的是获取新鲜和预热的聚酰胺 12 粉末在各种条件下的热导率，为激光烧结 (LS) 过程中有效和准确的控制提供基础。设计/方法/方法 – 采用瞬态平面源 (TPS) 技术的 Hot Disk® TPS 500 热测量系统进行热导率测量。聚酰胺 12 粉末以不同的密度包装，并使用不同的载气。还对全致密激光烧结聚酰胺 12 进行了测试，以建立基线。研究结果 – 聚酰胺 12 粉末的导热系数随堆积密度和温度的变化而变化，约为散装导热系数的三分之一。颗粒间键合是影响聚酰胺12导热系数的主要因素。研究限制/影响 - 测试了有限的密度范围，并且需要仔细控制载气以防止粉末氧化。热敏产品
Purpose – The purpose of this paper is to acquire thermal conductivities of both fresh and preheated polyamide 12 powder under various conditions to provide a basis for effective and accurate control during the laser sintering (LS) process. Design/methodology/approach – A Hot Disk® TPS 500 thermal measurement system using a transient plane source (TPS) technology was employed for thermal conductivity measurements. Polyamide 12 powder was packed at different densities, and different carrier gases were used. Tests were also performed on fully dense laser sintered polyamide 12 to establish a baseline. Findings – Polyamide 12 powder thermal conductivity varies with packing density and temperature, which is approximately one-third bulk form thermal conductivity. Inter-particle bonding is the primary factor influencing polyamide 12 thermal conductivity. Research limitations/implications – Limited ranges of density were tested, and the carrier gas needed carefully control to prevent powder oxidation. Thermal pro...