Analysis of Complete Power-Distribution Network and Co-Design Optimization
Analysis of Complete Power-Distribution Network and Co-Design Optimization
复制标题
完整配电网络分析和协同设计优化
DOI：
10.5104/jiepeng.2.69
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发表时间：
2009
期刊：
影响因子：
--
通讯作者：
Yo Takahashi
中科院分区：
文献类型：
--
作者：
N. Takahashi;M. Nose;Satoshi Kaeko;Yo Takahashi
本文描述了一个配电网络的建模分析，并演示了协同设计和协同仿真使用详细的原型模型，其中包括一个芯片，封装和印刷电路板。电路模拟器和使用有限元法的2D求解器被用来研究核心开关噪声的频率和瞬态响应。在该模型中，我们假设一个芯片模型（电流分布和片上电容），并定义与等效电路的电路参数，以满足目标阻抗。然后进行封装和印刷电路板的物理设计，检查所有所需的电路参数。根据建模和评估，底层采用低等效串联电感电容和薄芯结构的封装设计比顶层电容更有优势。
This paper describes the modelling analysis for a power-distribution network and demonstrates co-design and co-simulation in using the detailed prototype model, which includes a chip, package, and printed circuit board. A circuit simulator and a 2D solver using the finite element method are used to study the frequency and transient responses for the core switching noise. In the model, we assume a chip model (current profile and on-chip capacitance) and define the circuit parameters with an equivalent circuit to meet the target impedance. Then the physical design of the package and printed circuit board were done to check all of the required circuit parameters. According to the modelling and evaluation, the package design with a low equivalent series inductance capacitor in the bottom layer and a thin core structure is more advantageous than a capacitor in the top layer.