Tuning Dual-Dynamic Network Materials through Polymer Architectural Features

Tuning Dual-Dynamic Network Materials through Polymer Architectural Features
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DOI:
10.1021/acsapm.1c01827
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发表时间:
2022-01
影响因子:
5
通讯作者:
Nethmi De Alwis Watuthanthrige;Derrick Dunn;Madison T. Dolan;J. L. Sparks;Z. Ye;Mehdi B. Zanjani;Dominik Konkolewicz
Nethmi De Alwis Watuthanthrige;Derrick Dunn;Madison T. Dolan;J. L. Sparks;Z. Ye;Mehdi B. Zanjani;Dominik Konkolewicz
中科院分区:
化学2区
文献类型:
--
作者:
Nethmi De Alwis Watuthanthrige;Derrick Dunn;Madison T. Dolan;J. L. Sparks;Z. Ye;Mehdi B. Zanjani;Dominik Konkolewicz

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动态材料以其自修复、粘合剂和形状记忆应用而闻名。互穿网络(IPN)是一类可以容纳双动态交联剂以显示互补的化学和机械性能的材料。已经有许多研究探索IPN材料中涉及的动态化学。不仅键型,而且聚合物网络结构在控制IPN材料性能中起重要作用。在这项研究中,我们表明,网络结构的功能是一样重要的研究动态化学使用的IPN系统与四极氢(H)键和硫醇迈克尔(TM)键。这项工作改变了网络类型,链长,动态键组成,交联密度,和交联分布在一个系统内,以探讨其对热机械性能的影响。H和TM键的协同效应显示出优异的应力松弛和自愈合在室温和高温下。链长和交联密度的增加使材料的强度提高到高达3.5 MPa,而交联分布提高了在施加力下的抗蠕变性。此外,互补的H和TM粘合有助于改善这些材料的粘合性能,以与粘合的木条保持高达2kg的重量。
Dynamic materials are known for their self-healing, adhesive, and shape memory applications. Interpenetrating networks (IPNs) are types of materials that can hold dual-dynamic crosslinkers to show complementary chemical and mechanical properties. There have been a number of research studies exploring the dynamic chemistries involved in IPN materials. Not only the bond type but also the polymer network architecture play an important role in governing IPN material properties. In this study, we show that network architectural features are as much as important as studying the dynamic chemistries using an IPN system with quadrupole hydrogen (H) bonding and thiol-Michael (TM) bonding. This work varied network types, chain lengths, dynamic bond compositions, crosslink densities, and crosslink distributions within a system to explore their effects on the thermomechanical properties. The synergetic effects of H and TM bonds revealed excellent stress relaxation and self-healing at room temperature and elevated temperatures. Increment of chain length and crosslink density enhanced the strength of the materials to as high as 3.5 MPa, while the crosslink distribution boosted the creep resistance under an applied force. Furthermore, complementary H and TM bonding assisted in improving the adhesive properties in these materials to hold up to 2 kg weight with the adhered wood strips.