Thermo-elasto-plastic stresses in functionally graded materials subjected to thermal loading taking residual stresses of the fabrication process into consideration

Thermo-elasto-plastic stresses in functionally graded materials subjected to thermal loading taking residual stresses of the fabrication process into consideration
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DOI:
10.1016/s1359-8368(00)00049-4
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发表时间:
2001
影响因子:
13.1
通讯作者:
Y. Shabana;N. Noda
Y. Shabana;N. Noda
中科院分区:
工程技术1区
文献类型:
--
作者:
Y. Shabana;N. Noda

文献摘要

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功能梯度材料(FGM)是近年来受到广泛关注的一类材料,主要用于高温环境下的航天飞行器。功能梯度材料是一种复合材料,由不同材料组分从一个表面到另一个表面的连续变化组成。功能梯度材料通常在高温下制备,在高温下功能梯度材料具有无应力条件。功能梯度材料从制造温度冷却到室温后,产生残余热应力。基于细观组合律,采用有限元法对颗粒增强复合材料功能梯度材料矩形板在从制造温度冷却到室温、加热和冷却后加热三种温度条件下的弹塑性热应力进行了分析。分析中采用了考虑温度变化和损伤过程的颗粒增强复合材料热应力本构方程。讨论了颗粒体积分数和三种温度条件对基体应力、颗粒应力和宏观应力的影响。
Functionally graded materials (FGMs) have recently been received with considerable interest, primarily as high temperature resistant materials for space vehicles subjected to high temperature environment. FGMs are one of the composite materials and consist of continuous change of composition of different material components from one surface to the other. FGMs usually fabricated at high temperature at which the FGMs have stress free condition. After the FGMs cooled from the fabrication temperature to the room temperature residual thermal stresses produced. In this paper, elasto-plastic thermal stresses in a rectangular plate (FGP) of a particle reinforced composite FGM are treated by finite element method due to the microscopic combination law when the FGP is subjected to three kinds of temperature conditions, first is cooling from the fabricated temperature to the room temperature, second is heating and last is heating after cooling from the fabricated temperature. In the analysis, the thermal stress constitutive equation of a particle-reinforced composite taking temperature change and damage process into consideration is used. The effects of the particle volume fraction and the three kinds of temperature conditions on the stresses in the matrix, stresses in the particle and macroscopic stress are discussed.