An ultrasonic bridge for the study of viscoelastic properties of thin interface films
An ultrasonic bridge for the study of viscoelastic properties of thin interface films
复制标题
用于研究界面薄膜粘弹性特性的超声波电桥
DOI：
10.1121/1.389427
复制
发表时间：
1983
影响因子：
2.4
通讯作者：
S. Rokhlin
中科院分区：
文献类型：
--
作者：
S. Rokhlin
目前正在发展的弹性界面波方法已被证明是研究固体中界面粘弹性性质的有效方法。本论文涉及一种改进的测量方法的发展，采用超声界面波，这使得有可能调查薄界面层的热机械性能。通过使用差分声学系统消除了衬底和传感器中温度变化的影响。梳状换能器用于激发和接收超声波。
The method of elastic interface waves which is currently under development has proven effective in the investigation of viscoelastic properties of interfaces in solid bodies. The present paper is concerned with the development of a modified method of measurement, employing ultrasonic interface waves, which makes it possible to investigate the thermomechanical properties of thin interface layers. The effect of temperature variations in the substrates and transducers is eliminated by using a differential acoustic system. Comb transducers are used for excitation and reception of ultrasonic waves.