Anisotropic Highly Conductive Joints utilizing Cu-Solder Microcomposite Structure for High-Temperature Electronics Packaging
Anisotropic Highly Conductive Joints utilizing Cu-Solder Microcomposite Structure for High-Temperature Electronics Packaging
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DOI：
10.1016/j.matdes.2022.111204
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发表时间：
2022-09
期刊：
影响因子：
--
通讯作者：
H. Tatsumi;H. Nishikawa
中科院分区：
文献类型：
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作者：
H. Tatsumi;H. Nishikawa
功率转换系统的小型化要求功率模块的高功率密度操作，导致热密度增加。因此，必须发展键合技术，以实现高导热性和可靠的高温接头。在这项研究中，我们提出了一种新的各向异性微复合材料（AMC）接头，集成了莲花型多孔铜（LPC）片和锡基焊料的高温电子应用。在一个简单的回流过程中，通过将熔融焊料渗透到LPC片的单向孔中，成功地制造了AMC接头。对一种独特设计的样品进行稳态热导率测量，结果表明其等效热导率为142.4 W/m·K，是焊料的2.5倍。有限元模拟支持其优异的热性能，通过调查的热通量分布和热导率预测，利用三维图像为基础的构建模型。此外，在200 °C下1008小时的老化测试澄清了超过46 MPa的稳定剪切强度。这表明在200 °C下具有可靠的机械性能，该温度仅比焊料的熔点低20 °C。这些实验和数值研究证明了这种新型接头作为高温电子接头的潜力，并为其热性能和机械性能的增强提供了可能的机制。
The miniaturization of power conversion systems requires high-power density operation of power modules, causing the heat-density increase. Therefore, it is essential to develop bonding technology to realize highly thermally conductive and reliable high-temperature joints. In this study, we propose a novel anisotropic microcomposite (AMC) joint that integrates a lotus-type porous Cu (LPC) sheet and Sn-based solder for high-temperature electronic applications. The AMC joint was successfully fabricated by infiltrating the molten solder into the unidirectional pores of the LPC sheet during a simple reflow process. Steady-state thermal conductivity measurements for a uniquely designed specimen revealed its equivalent thermal conductivity (142.4 W/m·K), 2.5 times higher than the solder. Finite element simulations supported its excellent thermal performance by investigating the heat flux distribution and thermal conductivity prediction that utilize a three-dimensional image-based constructed model. In addition, the aging test at 200 °C for 1008 h clarified a stable shear strength of over 46 MPa. This indicates a reliable mechanical performance at 200 °C, which is only 20 °C below the melting point of the solder. These experimental and numerical studies proved the potential of the novel joint as a high-temperature electronics joint and offered possible mechanisms for its thermal and mechanical property enhancement.