Effect of the Bonding layer and Multi-Grading Layers on the Performance of Wafer-Bonded InGaAs/Si Single-Photon Detector
Effect of the Bonding layer and Multi-Grading Layers on the Performance of Wafer-Bonded InGaAs/Si Single-Photon Detector
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DOI：
10.1364/ao.482982
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发表时间：
2023
期刊：
影响因子：
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通讯作者：
Songyan Chen
中科院分区：
文献类型：
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作者：
Xiaoqiang Chen;Jinlong Jiao;Liqiang Yao;Ruoyun Ji;Yingjie Rao;Wei Huang;Guangyang Lin;Cheng Li;Shaoying Ke;Songyan Chen
