Processing of transparent materials using visible nanosecond laser pulses
Processing of transparent materials using visible nanosecond laser pulses
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使用可见纳秒激光脉冲加工透明材料
DOI：
10.1007/s00339-006-3847-y
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发表时间：
2007
期刊：
影响因子：
--
通讯作者：
M. Bereznai
中科院分区：
文献类型：
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作者：
B. Hopp;T. Smausz;M. Bereznai
从微光学元件制造的角度来看，透明材料的激光微细加工是一个非常热门的研究领域。激光诱导背面干法刻蚀(LIBDE)是最有前途的间接加工方法之一。在该方法中，透明靶与固体薄层接触，固体薄层吸收并转换脉冲能量，从而产生刻蚀。利用可见光纳秒染料激光器(λ=500 nm，半高宽=11 ns)和100 nm厚的铝吸收层，研究了LIBDE技术在熔融二氧化硅加工中的适用性。光照强度在0~3050mJ/cm2范围内变化，光照面积为0.1mJ/cm2。熔融二氧化硅LIBDE刻蚀的阈值注量约为540nmJ/cm2。用场发射扫描电子显微镜和能量色散X射线能谱分析了刻蚀孔表面及其周围的化学成分。结果表明，被照亮的熔融二氧化硅的上∼1-μm厚体积中铝的平均含量为0.4at.3at.Al，而原始表面的铝含量低于检测下限。实验证明，LIBDE过程适用于可见纳秒激光对透明材料的微加工。
Laser micromachining of transparent materials is an intensively studied research area from the point of view of microoptical element fabrication. One of the most promising indirect processing methods is the laser-induced back-side dry etching (LIBDE). During this method, transparent targets are contacted with solid thin layers, which absorb and transform the pulse energy resulting in etching. The applicability of LIBDE technology for processing of fused silica using a visible nanosecond dye laser (λ=500 nm, FWHM=11 ns) and a 100-nm-thick aluminium absorbing layer was investigated. The applied fluence was varied in the range of 0–3050 mJ/cm2; the illuminated area was 0.1 mm2. The threshold fluence of the LIBDE etching of fused silica was found to be approximately 540 mJ/cm2. The chemical composition of the surface layers on and around the etched holes was investigated by field-emission scanning electron microscopy and energy-dispersive X-ray spectrometry. It was found that on average 0.4±0.3 at. % aluminium is built into the upper ∼1-μm-thick volume of the illuminated fused silica, while the aluminium content fell below the detection limit in the case of the original surface. Our experiments proved that the LIBDE procedure is suitable for microprocessing of transparent materials using visible nanosecond laser light.