Al/Ni Self-Propagating Exothermic Film for MEMS Application
Al/Ni Self-Propagating Exothermic Film for MEMS Application
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DOI：
10.4028/www.scientific.net/msf.638-642.2142
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发表时间：
2010-01
期刊：
影响因子：
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通讯作者：
T. Namazu;S. Inoue
中科院分区：
文献类型：
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作者：
T. Namazu;S. Inoue
本文叙述了用Al/Ni膜放热反应加热的Ag-Sn-Si接头的强度评定方法。反应产生的热量足以熔化Ag-Sn膜进行焊接。为了测量强度，四点微弯曲测试技术已经发展。通过在各种压力载荷下切割键合的Si晶片来制备具有Ag-Sn/AlNi/Ag-Sn截面的矩形固体Si样品。压力越高，Al/Ni与Ag-Sn之间的接触越好，热传导越好，从而使Ag-Sn充分熔化。Al/Ni反应膜在MEMS焊接中具有作为微加热器的潜力。
This paper describes evaluation of the strength in Ag-Sn-jointed Si specimens heated by Al/Ni film’s exothermic reaction. The reaction generates heat enough to melt Ag-Sn film for soldering. To measure the strength, four-point micro-bending test technique has been developed. The rectangular-solid Si specimens having a Ag-Sn/AlNi/Ag-Sn section were prepared by dicing the bonded Si-wafer under various pressure loads. A higher pressure yielded a better contact condition between Al/Ni and Ag-Sn so that heat-conduction improved; consequently Ag-Sn was melted sufficiently. Al/Ni reactive film has a potential as a micro-heater in soldering for MEMS.