Ferroelectrics at the nanoscale
Ferroelectrics at the nanoscale
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DOI:
10.1002/pssa.200824434
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发表时间:
2009-03
期刊:
影响因子:
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通讯作者:
J. Gregg
中科院分区:
文献类型:
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作者:
J. Gregg
There are several factors which make the investigation and understanding of nanoscale ferroelectrics particularly timely and important. Firstly, there is a market pressure, primarily from the electronics industry, to integrate ferroelectrics into devices with progressive decreases in size and increases in morphological complexity. This is perhaps best illustrated through the roadmaps for product development in FeRAM (Ferroelectric Random Access Memory) where the need for increases in bit density will require a move from 2D planar capacitor structures to 3D trenched capacitors in the next few years. Secondly, there is opportunity for novel exploration, as it is only relatively recently that developments in thin film growth of complex oxides, self‐assembly techniques and high‐resolution ‘top–down’ patterning have converged to allow the fabrication of isolated and well‐defined ferroelectric nanoshapes, the properties of which are not known. Thirdly, there is an expectation that the behaviour of small scale ferroelectrics will be different from bulk, as this group of functional materials is highly sensitive to boundary/surface conditions, which are expected to dominate the overall response when sizes are reduced into the nanoscale regime.