End Point Determination of Aluminum CCl4 Plasma Etching by Optical Emission Spectroscopy
End Point Determination of Aluminum CCl4 Plasma Etching by Optical Emission Spectroscopy
复制标题
发射光谱法测定铝 CCl4 等离子蚀刻的终点
DOI:
10.1149/1.2131559
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发表时间:
1978
期刊:
影响因子:
--
通讯作者:
H. Brunner
中科院分区:
文献类型:
--
作者:
B. J. Curtis;H. Brunner
The use of optical emission spectra for end point detection has been reported for the CF 4 plasma etching of Si (l, 2) and for the 02 plasma stripping of photoresist (3, 5). This note reports the application of the method to the CCI 4 plasma etching of aluminiumEtching experiments were carried out in a parallel plate reactor consisting of a pyrex glass cylinder 30 cm in diameter and 35 cm high with ports to accommodate a silica window and a quadrupole mass-spectrometer; the end plates were made of stainless steel. The water-cooled electrodes, made of polished nickel-plated copper, were 20 cm in diameter and, for these experiments, were spaced 40 mm apart. CCl 4 was introduced through the centre of the upper electrode which was connected to a 13.56 MHz rf generator. The substrates were placed on the lower, grounded electrode. Optical emission spectra were taken on a Heathkit EUE-. 700 Monochromator using an RCA photomultiplier type IP28, a Keithley 601 electrometer as an amplifier and a chart recorder. The distance between the monochromator entrance slit and the plasma was 30 cm; the emission was viewed through the silica window without focussing.