Errata: Thermal Properties of Al/β-SiC Composite Fabricated in Continuous Solid-Liquid Co-Existent State by SPS
Errata: Thermal Properties of Al/β-SiC Composite Fabricated in Continuous Solid-Liquid Co-Existent State by SPS
复制标题
勘误表：SPS 连续固液共存状态制备 Al/β-SiC 复合材料的热性能
DOI：
10.2497/jjspm.58.155
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发表时间：
2011
期刊：
影响因子：
--
通讯作者：
Mikio Ito
中科院分区：
文献类型：
--
作者：
K. Mizuuchi;K. Inoue;Y. Agari;T. Nagaoka;Y. Morisada;M. Sugioka;Motohiro Tanaka;T. Takeuchi;J. Tani;M. Kawahara;Y. Makino;Mikio Ito
采用放电等离子烧结（SPS）技术，以SiC粉、Al粉和Al-5mass%Si粉为原料，在固液共存状态下制备了SiC颗粒弥散分布的Al基复合材料。研究了复合材料的微观结构和导热性能。在SPS过程中，通过在798 K和876 K之间的温度范围内加热1.56 ks，这些复合材料都得到了很好的固结。对于在本研究采用的烧结条件下制备的复合材料，扫描电子显微镜观察到SiC颗粒与Al基体之间的界面没有反应。在SiC体积分数为40%~ 55%的范围内，Al/SiC复合材料的相对堆积密度大于99%。Al/SiC复合材料的热导率随着复合材料中SiC含量的增加而增加，在40和50体积分数范围内。当Al含量为50 vol.%时，导热系数最高SiC复合材料，并达到252 W/mK。复合材料的热膨胀系数福尔斯落在Kerner模型的上线，表明复合材料中SiC颗粒与Al基体之间存在较强的结合。
SiC-particle-dispersed-aluminum (Al) matrix composites were fabricated in solid-liquid co-existent state by Spark Plasma Sintering (SPS) process from the mixture of SiC powders, Al powders and Al-5mass%Si powders. The microstructures and thermal conductivities of the composites fabricated were examined. These composites were all well consolidated by heating at a temperature range between 798 K and 876 K for 1.56 ks during SPS process. No reaction at the interface between the SiC particle and the Al matrix was observed by scanning electron microscopy for the composites fabricated under the sintering conditions employed in the present study. The relative packing density of the Al/SiC composite fabricated was higher than 99 % in a volume fraction range of SiC between 40 % and 55 %. Thermal conductivity of the Al/SiC composite increased with increasing the SiC content in the composite in a volume fraction range between 40 and 50 vol.%. The highest thermal conductivity was obtained for Al-50vol.%SiC composite and reached 252 W/mK. The coefficient of thermal expansion of the composites falls in the upper line of Kerner's model, indicating strong bonding between the SiC particle and the Al matrix in the composite.