Finite Element Simulation of Inkjet Printed Flexible Parallel Plate MIM Capacitors on Polyimide Film
Finite Element Simulation of Inkjet Printed Flexible Parallel Plate MIM Capacitors on Polyimide Film
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DOI：
10.1109/eit51626.2021.9491846
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发表时间：
2021-05
期刊：
影响因子：
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通讯作者：
Moriom R. Momota;Ankita Mohapatra;B. Morshed
中科院分区：
文献类型：
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作者：
Moriom R. Momota;Ankita Mohapatra;B. Morshed
由于柔性电子喷墨印刷（IJP）的潜在用途在柔性电子产品中迅速增长，我们提出了一个有限元分析（FEA）与金属-绝缘体-金属（MIM）型平行板电容器的静电建模使用COMSOL Multiphysics设计用于柔性电子电路。在这项研究中，银被用作导电金属平行板和聚（4-乙烯基苯酚）（PVP）被用作绝缘体材料。我们将我们的模拟结果与IJP平行板电容器进行了比较，其中底部和顶部板用JS B40银油墨印刷，介电层用PVP介电油墨印刷。我们还比较了我们的模拟结果与理想的计算电容值。我们的模拟结果是有前途的，并与制造电容的计算和实验结果密切匹配。我们展示了电容的变化，由于设计参数的变化，如，电容的面积。我们的印刷IJP电容器为电容器面积1至36 mm提供了8.8 pF至467 pF范围内的电容，而模拟电容范围记录在9 pF至455 pF之间。对于四涂层PVP，模拟获得的最小和最大电容分别为13.3 pF和455 pF（电容器面积1 mm 2和36 mm 2）。对于1 mm 2和36 mm 2电容器面积，具有六个涂层PVP的模拟电容分别为9 pF和310 pF。对于柔性电子设备，如身体穿戴式传感器，IJP电子元件将在不久的将来显着，本文奠定了关键的基础，这方面的奋进。
As the potential usage of flexible electronics inkjet printing (IJP) is rapidly growing in flexible electronics, we present a Finite Element Analysis (FEA) with electrostatic modeling of a Metal-Insulator-Metal (MIM) type parallel plate capacitor using COMSOL Multiphysics designed for application in flexible electronic circuits. In this study, silver was used as the conductive metal parallel plates and Poly(4-vinylphenol) (PVP) was used as the insulator material. We compared our simulated result with IJP parallel plate capacitors where the bottom and top plate was printed with JS B40 silver ink and dielectric layer was printed with PVP dielectric ink. We also compared our simulation results with ideal calculated capacitance values. Our simulated results are promising and matched closely with the calculated and experimental results from fabricated capacitances. We demonstrated the change of capacitance due to variance of design parameters, such as, the area of the capacitance. Our printed IJP capacitors provided us the capacitance in the range of 8.8 pF to 467 pF for capacitor area 1 to 36 mm, while the simulated capacitance range was recorded between 9 pF to 455 pF. For four coat PVP the minimum and maximum capacitance obtained from simulations were 13.3 pF and 455 pF for capacitor area 1 mm2 and 36 mm2 respectively. The simulated capacitances with six coat PVP were 9 pF and 310 pF for 1 mm2 and 36 mm2 capacitor area respectively. For flexible electronics devices like body-worn sensors, IJP electronic components will be significant in near future and this paper lays the key foundation for that endeavor.