Durability of Silicide-Based Thermoelectric Modules at High Temperature in Ar
Durability of Silicide-Based Thermoelectric Modules at High Temperature in Ar
复制标题
硅化物基热电模块在氩气中高温下的耐久性
DOI：
10.1007/s11664-015-3784-7
复制
发表时间：
2015
影响因子：
2.1
通讯作者：
E.Combe
中科院分区：
文献类型：
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作者：
R.Funahashi;Y.Matsumura;T.Barbier;T.Takeuchi;R.O.Suzuki;S.Katsuyama;A.Yamamoto;H.Takazawa;E.Combe
用Ag与Pt或Pd的复合浆料制备了n型Mn2.7Cr0.3Si4Al2和p型MnSi1.75腿的热电组件。在873 K的热源温度下，采用Ni-B镀层和Ag浆料制备的组件的比功率密度达到370 mW/cm 2。在硅化物管脚表面镀5μm厚的Ni-B，可降低硅化物管脚的内阻，并降低其在873 K温度下的功率衰减。这是因为Al的氧化扩散到n型腿中并到达热侧和冷侧上的Ag电极。Ni-B镀层可以抑制Al在Inton型引脚中的扩散。然而，在p型引脚上的Ni-B镀层中间观察到平行于接触表面的裂纹。还发现，将Pt或Pd掺入到Ag膏中有效地抑制了硅化物腿和Ag电极之间的接触电阻的劣化。
Thermoelectric modules consisting ofn-type Mn2.7Cr0.3Si4Al2andp-type MnSi1.75legs have been fabricated by use of composite pastes of Ag with Pt or Pd. For the module prepared by Ni-B plating and with Ag paste, the specific power density reached 370 mW/cm2at a heat-source temperature of 873 K. Ni-B plating 5μm thick on the surfaces of the silicide legs reduced both the internal resistance and degradation of the power generated by silicide modules at temperatures up to 873 K in air. This is because of oxidation of Al diffusing into then-type legs and reaching the Ag electrodes on both the hot and cold sides. Ni-B plating can suppress Al diffusion inton-type legs. However, cracking was observed parallel to the contact surface in the middle of the Ni-B plating layer on thep-type legs. It was also found that incorporating Pt or Pd into the Ag paste effectively suppressed degradation of the contact resistance between the silicide legs and the Ag electrodes.