Influence of Ag-modified graphene nanosheets addition into Sn–Ag–Cu solders on the formation and growth of intermetallic compound layers
Influence of Ag-modified graphene nanosheets addition into Sn–Ag–Cu solders on the formation and growth of intermetallic compound layers
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DOI：
10.1016/j.jallcom.2017.01.286
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发表时间：
2017-04
影响因子：
6.2
通讯作者：
H. Jing;H. Guo;Lijun Wang;W. Jin;L. Y. Xu;Y. Han
中科院分区：
文献类型：
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作者：
H. Jing;H. Guo;Lijun Wang;W. Jin;L. Y. Xu;Y. Han
在这项研究中，不同量的银改性石墨烯纳米片（Ag-GNS）添加到Sn-Ag-Cu（SAC）焊料合成复合焊料。然后，在液-固反应和等温时效过程中的金属间化合物（IMC）层的形貌和厚度进行了研究。测试结果表明，钎焊后的IMC呈扇贝形，但随着时效时间的延长，IMC由扇贝形变为不规则形状。复合焊料的IMC厚度和扩散系数均低于普通焊料。此外，值得注意的是，在相同的增强量下，与单独用GNS增强的焊料相比，用Ag-GNS增强的复合焊料表现出更薄的IMC层和更低的扩散系数。此外，使用球磨制备的Ag-GNS产生较薄的IMC层和较低的扩散系数比相同量的Ag-GNS通过使用搅拌机的机械混合。我们的研究结果表明，Ag-GNS是更有影响力的延迟IMC层的生长比GNS单独和球磨具有优势，使用搅拌机的机械混合制备的Ag-GNS复合焊料。
In this study, varying amounts of Ag-modified graphene nanosheets (Ag-GNSs) were added to Sn–Ag–Cu (SAC) solders to synthesize composite solders. Then, the morphology and thickness of the intermetallic compound (IMC) layers were investigated during the liquid–solid reactions and isothermal aging. The test results revealed that the IMCs were scallop-shaped after soldering, but they changed from scallop-shaped to an irregular shape with increasing aging time. The IMC thickness and diffusion coefficients of the composite solders were both found to be lower than those of the plain solders. Moreover, it is worth noting that with the same amount of reinforcement, the composite solders reinforced with Ag-GNSs exhibited thinner IMC layers and lower diffusion coefficients than the solders reinforced with GNSs alone. Furthermore, Ag-GNSs prepared using ball milling yielded thinner IMC layers and lower diffusion coefficients than the same amount of Ag-GNSs preparedviamechanical mixing using a blender. Our results indicate that Ag-GNSs are more influential on delaying the growth of IMC layers than GNSs alone and that ball milling has advantages over mechanical mixing using a blender for the preparation of Ag-GNS composite solders.