New polishing method using water-based slurry under AC electric field for glass substrate
New polishing method using water-based slurry under AC electric field for glass substrate
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DOI：
10.1016/j.jmmm.2010.11.053
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发表时间：
2011-05
影响因子：
2.7
通讯作者：
T. Kusumi;Yasuhiro Sato;Y. Akagami;N. Umehara
中科院分区：
文献类型：
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作者：
T. Kusumi;Yasuhiro Sato;Y. Akagami;N. Umehara
提出了一种交流电场辅助水基抛光液抛光硼硅酸盐玻璃的新方法。已经发现，所施加的电场有效地将具有磨料的浆料定位在抛光区域中。现场观测也证实了交流电场对泥浆运动的影响。在最佳抛光条件下，硼硅玻璃板的加工时间比无交流电场条件下缩短。抛光时间为30min时，抛光去除量从14 μm增加到22μm。这表明在抛光过程中施加电场可以提高生产率1.5倍。
We proposed an AC electric field-assisted novel polishing method for borosilicate glass plate with water-based slurry. It has been found that the applied electric field operates effectively in positioning the slurry with abrasives in the polishing area. In-situ observations also confirmed that the AC electric field affected the motion of slurry. Under optimal polishing conditions, the processing time of borosilicate glass plate was shortened compared to AC electric field free conditions. Furthermore, the polishing removal amount was increased from 14 to 22μm for a polishing time of 30min. This suggests that the productivity could be enhanced by 1.5 times by applying electric field during polishing.