A Fabrication Process for Microstrip-Coupled Superconducting Transition Edge Sensors Giving Highly Reproducible Device Characteristics
A Fabrication Process for Microstrip-Coupled Superconducting Transition Edge Sensors Giving Highly Reproducible Device Characteristics
复制标题
微带耦合超导过渡边缘传感器的制造工艺，具有高度可重复的器件特性
DOI：
10.1007/s10909-007-9635-z
复制
发表时间：
2008
影响因子：
2
通讯作者：
A. Bunting
中科院分区：
文献类型：
--
作者：
D. Glowacka;D. Goldie;S. Withington;M. Crane;V. Tsaneva;M. D. Audley;A. Bunting
摘要
用于测量宇宙微波背景偏振的天文仪器，如三叶草，需要大阵列的超导过渡边缘传感器（TES）。我们报告最近的结果，旨在高产量制造的微带耦合TES的加工路线的发展。输入信号通过超导微带传输线传递到氮化硅膜上。然后，该传输线端接薄膜负载电阻器。基于晶片的制造路线的Mo/Cu TES给出了高度可再现的设备特性的超导转变温度，电气和热特性。一个整体的设备产量为65%已经实现了多晶片处理运行。
Abstract
Astronomical instruments for measuring Cosmic Microwave Background polarisation, such as CLOVER, require large arrays of Superconducting Transition Edge Sensors (TESs). We report recent results from a processing route development aimed at high yield fabrication of microstrip-coupled TESs. The incoming signal is delivered onto a silicon nitride membrane by means of a superconducting microstrip transmission line. This transmission line is then terminated with a thin-film load resistor. The wafer-based fabrication route of the Mo/Cu TESs gives highly reproducible device characteristics in terms of superconducting transition temperature, electrical and thermal characteristics. An overall device yield of 65% has been achieved for a multi-wafer processing run.