The element connectivity parameterization formulation for the topology design optimization of multiphysics systems
The element connectivity parameterization formulation for the topology design optimization of multiphysics systems
复制标题
多物理场系统拓扑设计优化的单元连接参数化公式
DOI：
10.1002/nme.1422
复制
发表时间：
2005
影响因子：
2.9
通讯作者：
Y. Kim
中科院分区：
文献类型：
--
作者：
G. Yoon;Y. Kim
尽管基于单元密度的拓扑优化方法在包括多物理场设计问题在内的许多问题中取得了成功，但仍然存在一些数值困难，如温度下冲。在这项工作中，我们开发了一个元素连接参数化（ECP）制定的多物理场问题的拓扑优化，以避免数值困难，并产生改进的结果。在建议的ECP制定，有限元离散一个给定的设计域不直接连接，但通过一组一维零长度链接模拟弹性弹簧，电或热导体。离散化有限元在整个分析过程中保持实体状态，最优布局由单元间连接度的最优分布确定，连接度由连杆的刚度值控制。详细的程序，这种新的配方多物理场问题。利用一维传热模型，解释了基于单元密度的方法存在的问题，并指出了ECP方法的优点。版权所有© 2005年约翰威利父子有限公司。
In spite of the success of the element-density-based topology optimization method in many problems including multiphysics design problems, some numerical difficulties, such as temperature undershooting, still remain. In this work, we develop an element connectivity parameterization (ECP) formulation for the topology optimization of multiphysics problems in order to avoid the numerical difficulties and yield improved results. In the proposed ECP formulation, finite elements discretizing a given design domain are not connected directly, but through sets of one-dimensional zero-length links simulating elastic springs, electric or thermal conductors. The discretizing finite elements remain solid during the whole analysis, and the optimal layout is determined by an optimal distribution of the inter-element connectivity degrees that are controlled by the stiffness values of the links. The detailed procedure for this new formulation for multiphysics problems is presented. Using one-dimensional heat transfer models, the problem of the element-density-based method is explained and the advantage of the ECP method is addressed. Copyright © 2005 John Wiley & Sons, Ltd.