Microelectronic packaging for retinal prostheses
Microelectronic packaging for retinal prostheses
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DOI：
10.1109/memb.2005.1511500
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发表时间：
2005-09-01
影响因子：
--
通讯作者：
Tai, YC
中科院分区：
文献类型：
--
作者：
Rodger, DC;Tai, YC
讨论了一种用于视网膜植入物的基于聚对二甲苯的高密度芯片级集成互连（CL-I/sup 2/）封装系统。这种CL-I/sup 2/技术对视网膜假体包装工作的影响是深远的。该技术消除了技术人员逐个创建电气和机械连接的需要。相反，该技术仅受标准光刻和标准微制造技术的限制，提供了在工艺中可以容纳的中心到中心焊盘距离中减少一个数量级或更多的能力。因此，高密度电极阵列是可行的，因为制造过程对可以合理地连接到阵列的输出焊盘的数量没有限制。
An innovative parylene-based high-density chip-level integrated interconnect (CL-I/sup 2/) packaging system for retinal implants id discussed. The implications of this CL-I/sup 2/ technology for retinal prosthesis packaging effort are far-reaching. This technology obviates the need for a technician to create electrical and mechanical connections one by one. Instead, the technology is limited only by standard photolithography and standard microfabrication techniques, providing the capability for a reduction of an order of magnitude or more in the center-to-center pad distances that can be accommodated in the process. High-density electrode arrays are thereby feasible, because the fabrication process places no limit on the number of output pads that can reasonably be connected to the array.