Nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process
Nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process
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DOI：
10.1016/j.mee.2008.02.015
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发表时间：
2008-07-01
影响因子：
2.3
通讯作者：
Ho, Yu-Lun
中科院分区：
文献类型：
--
作者：
Chen, Henry J. H.;Chen, Li-Chun;Ho, Yu-Lun
研究了利用反转压印和剥离工艺在柔性聚酰亚胺衬底上进行Au纳米金属化。制备了纳米硅模具：提高了纳米硅模具的抗粘附性能，并通过接触角测量计算了纳米硅模具的表面自由能。利用该工艺在硅衬底和柔性聚酰亚胺衬底上成功制备了宽度约为150 nm的Au纳米线。通过SEM分析，研究了PMMA厚度对反向压印和Au纳米线剥离结果的影响。(C)2008 Elsevier B.V.保留所有权利。
The nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process was investigated. The nano-scale mold was fabricated: the anti-adhesion property of nanometer-size Si-mold was improved and the surface free energy was calculated with the contact angle measurement. The similar to 150 nm width Au nano-wires were successfully fabricated on Si and on flexible polyimide substrate with the proposed process. The PMMA thickness dependent trend with reversal imprinting and Au nanowires lift-off results were also investigated by SEM analysis. (C) 2008 Elsevier B.V. All rights reserved.