A tiny heat probe for measuring the thermal conductivities of non-rigid materials
A tiny heat probe for measuring the thermal conductivities of non-rigid materials
复制标题
DOI:
10.1088/0957-0233/5/11/003
复制
发表时间:
1994-11
影响因子:
2.4
通讯作者:
Shuxia Cheng;Y. Jiang;X. G. Liang
中科院分区:
文献类型:
--
作者:
Shuxia Cheng;Y. Jiang;X. G. Liang
An improved tiny heat probe for measuring the thermal conductivities of non-rigid materials has been developed. There have been a number of modifications suggested to the classical heat probe. In the present heat probe, a winding copper wire coated with a thin polyester layer, used as a heating element and a resistance thermometer, is enclosed in a thin metallic tube which is inserted into the measured medium. A regulation voltage is supplied to the wire. The thermal conductivities of the measured materials can be obtained from the resistance increase values in the wire over a known time interval. A correction formula for eliminating the effects of varying power in the heater and a time estimation for reducing the effects of the thermal constants and size of the probe are established. Using the heat probe, the thermal conductivities of non-rigid materials, such as fruits, powdered graphite, aqueous NaCl solution, distilled water and biotissues were measured with relative error less than 3%.