Process optimization of LIFT through visualization: towards high resolution metal circuit printing

Process optimization of LIFT through visualization: towards high resolution metal circuit printing
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通过可视化优化 LIFT 工艺:迈向高分辨率金属电路印刷

DOI:
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发表时间:
2014
期刊:
Photonics Europe
影响因子:
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通讯作者:
R. Mandamparambil
R. Mandamparambil
中科院分区:
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文献类型:
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作者:
M. Giesbers;M. Hoppenbrouwers;E. Smits;R. Mandamparambil

文献摘要

被引文献

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激光诱导正向转移 (LIFT) 是一种自由形态的附加图案化技术,能够沉积高分辨率金属结构。激光脉冲用于从供体材料生成小液滴,由脉冲的光斑尺寸和能量定义。金属和非金属材料都可以使用这种方法进行图案化。作为一种非接触式、增材式和高分辨率图案化技术,该方法能够制造多层电路,实现桥式印刷,从而减少元件间距。在这里,我们演示了从薄膜供体形成铜滴。 LIFT 过程的研究是通过阴影摄影完成的,并提供了有关液滴形成的详细信息。特别重要的是,在稳定的打印过程中,液滴喷射机制与供体和接收基板之间的间距之间的相互作用。讨论了激光注量和施主厚度等参数对液滴形成的影响。对飞行过程中的铜滴进行角度偏差分析,以估计转移的指向精度。了解液滴形成的可能性,可以允许以大间隙转移稳定的液滴,从而简化连续高分辨率导电线图案化的过程。
Laser induced forward transfer (LIFT) is a freeform, additive patterning technique capable of depositing high resolution metal structures. A laser pulse is used to generate small droplets from the donor material, defined by the spot size and energy of the pulse. Metallic as well as non-metallic materials can be patterned using this method. Being a contactless, additive and high resolution patterning technique, this method enables fabrication of multi-layer circuits, enabling bridge printing, thereby decreasing component spacing. Here we demonstrate copper droplet formation from a thin film donor. The investigation of the LIFT process is done via shadowgraphy and provides detailed insight on the droplet formation. Of particular importance is the interplay of the droplet jetting mechanism and the spacing between donor and receiving substrate on a stable printing process. Parameters such as the influence of laser fluence and donor thickness on the formation of droplets are discussed. An angle deviation analysis of the copper droplets during flight is carried out to estimate the pointing accuracy of the transfer. The possibility of understanding the droplet formation, could allow for stable droplets transferred with large gaps, simplifying the process for patterning continuous high-resolution conductive lines.