Fabrication of vertical molecular junction devices with conductive polymer contacts using a peeling method
Fabrication of vertical molecular junction devices with conductive polymer contacts using a peeling method
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使用剥离法制造具有导电聚合物触点的垂直分子结器件
DOI：
10.1166/jnn.2016.12278
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发表时间：
2016
期刊：
影响因子：
--
通讯作者：
and H. Naito
中科院分区：
文献类型：
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作者：
Y. Konishi;T. Nagase;T. Kobayashi;R. Ueda;T. Terui;A. Otomo;and H. Naito
我们提出了一种简单的技术图案化Au顶部电极的垂直分子结器件，具有导电聚合物，聚（3，4-乙撑二氧噻吩）-聚（4-苯乙烯磺酸盐）（PEDOT：PSS），作为自组装单层和Au顶部电极之间的接触层。在该方法中，使用SU-8的热固化光致抗蚀剂来限定形成顶部电极的区域。固化的SU-8的疏水性和低表面能有助于通过溶液去湿将PEDOT：PSS选择性沉积到器件的限定的顶部电极区域上，并且还使得能够使用粘合带物理剥离沉积在SU-8层上的Au顶部电极。通过这种方法，可以制造具有图案化的Au顶部电极的垂直分子结，而不采用传统方法中使用的荫罩蒸发工艺。我们制备了基于烷二硫醇自组装单分子膜的垂直分子隧道器件，有效面积为100 μm2。
We present a simple technique for patterning Au top electrodes in vertical molecular junction devices that have the conductive polymer, poly(3,4-ethylene dioxythiophene)-poly(4-styrene sulfonate) (PEDOT:PSS), as a contact layer between the self-assembled monolayer and the Au top electrode. In this method, a thermally curable photoresist of SU-8 is used to define the areas where the top electrodes are formed. The hydrophobicity and low surface energy of the cured SU-8 facilitates selective deposition of PEDOT:PSS onto the defined top electrode areas of the device through solution dewetting, and also enables the physical peeling of the Au top electrodes deposited on the SU-8 layers using an adhesion tape. Through this approach, vertical molecular junctions with patterned Au top electrodes can be fabricated without employing the shadow mask evaporation process used in the conventional approach. We processed vertical molecular tunneling devices based on self-assembled alkanedithiol monolayers with an active area of 100 μm2.