The Rise of Serial Memory and the Future of DDR
The Rise of Serial Memory and the Future of DDR
复制标题
串行内存的兴起和 DDR 的未来
DOI：
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发表时间：
2014
期刊：
影响因子：
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通讯作者：
T. Schmitz
中科院分区：
文献类型：
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作者：
T. Schmitz
由于没有计划定义“DDR5”规范，很明显，整个内存领域将在未来几年发生深刻变化。当前的DDR4代（包括专注于移动设备的LPDDR4低功耗型号）继续缓慢增长，但它本质上是同类产品中的最后一代，是基于DDR模型的最终一代内存技术。LPDDR在无线设备市场上被广泛接受，但随着无线技术每年一代（有时两代）的发展，LPDDR模型根本无法跟上。随着它们在竞争中变得可行，多种内存技术已经在争夺这一块内存市场空间的主导地位。目前的DDR市场预计将被新的串行存储器技术分割，并最终被接管，如混合存储器立方体（HMC）和其他仍在开发中的计划。FPGA和SOC等可编程逻辑器件必须在这些新的存储器方案进入市场时保持对它们的支持。这份白色白皮书解释了DDR型号使用寿命即将结束的原因，以及串行存储器方案如何满足未来的存储器需求。Xilinx UltraScale器件和平台从一开始就着眼于未来，提供了向新兴串行存储器技术的无缝过渡。
With no plans emerging to define a “DDR5” specification, it is certainly clear that the entire memory landscape is going to change profoundly over the coming years. The current DDR4 generation (including the mobile-focused LPDDR4 low-power model) continues to ramp up slowly, but it is essentially the last of its kind, the ultimate generation of memory technology based on the DDR model. LPDDR is being well-accepted in the wireless devices market, but with wireless technology evolving through a generation (or sometimes two) every year, the LPDDR model simply will not be able to keep up. As they become competitively viable, multiple memory technologies are already vying for dominance of this chunk of the memory market space. The current DDR market is expected to be split, and eventually taken over, by new serial memory technologies, like Hybrid Memory Cube (HMC) and other schemes still in the development pipeline. Programmable logic devices like FPGAs and SOCs must maintain support for these new memory schemes as they emerge into the marketplace. This white paper explains why the DDR model is now approaching the end of its useful lifetime, and how serial memory schemes can be expected to fill the memory needs of the future. Xilinx UltraScale devices and platforms have been engineered from the outset with the future in mind, providing a seamless transition to the newly emerging serial memory technologies.