Roll of Grain-boundary Free Energy & Surface Free Energy for Tin Whisker Growth
Roll of Grain-boundary Free Energy & Surface Free Energy for Tin Whisker Growth
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晶界自由能卷
DOI:
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发表时间:
2003
期刊:
影响因子:
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通讯作者:
U. Lindborg
中科院分区:
文献类型:
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作者:
K. Tsuji;J. D. Eshelby;U. Lindborg
Generally the grains of electroplated tin layers are considerably small in their sizes. Therefore the grain-boundary free energy is expected to act as a driving force for recrystallization and possibly subsequent tin whisker growth. On the other hand, if the dimension of a structure is sufficiently small like whiskers, then the morphology of the structure will be determined principally by the tendency to lower its surface free energy. Hence it is supposed that the surface free energy may be closely related to the whisker growth process. In this work, the grain-boundary free energy of tin electrodeposits has been estimated by determining the grain sizes as a function of the thickness. Then the morphology of various whiskers and so-called nodules, which are the irregularly shaped mass-extrusion from the tin surface, has been studied in order to reveal the roll of surface free energy in the whisker growth process. While the relation between the nodule growth and the grain growth, which is a stage of recrystallization, has been also studied by electron backscatter diffraction pattern method. It has been shown that the grain-boundary free energy is sufficient for spontaneous occurrence of grain growth of the deposits and the grain growth lead to the nodule growth. While many whiskers were found to grow on nodules. This means the whisker growth is closely related to the nodule growth. From these, it has been suggested that the whisker growth can be understood as a result of minimization of the surface free energy of nodules, which have large surface free energy as a result of their complicated surfaces. Farther more, it has been suggested that the minimization can be achieved by growing in some specific directions such as <001>, <100>, <101>, and <111>.