Laser Prototyping of Microwave Circuits in LTCC Technology
Laser Prototyping of Microwave Circuits in LTCC Technology
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DOI：
10.1109/tmtt.2009.2033846
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发表时间：
2009-11
影响因子：
4.3
通讯作者：
M. F. Shafique;K. Saeed;D. Steenson;I. Robertson
中科院分区：
文献类型：
--
作者：
M. F. Shafique;K. Saeed;D. Steenson;I. Robertson
本文报道了一种低温共烧陶瓷（LTCC）技术中微波电路的激光直接成型工艺。提出了一种有效的替代丝网印刷的原型电路的激光图案的导体上的未烧制的磁带。通过激光加工实现了50 μ m的线宽和间隙。为了优化工艺参数，已经使用扫描电子显微镜研究了一系列样品。用表面轮廓仪测量了激光处理样品的表面粗糙度，并与未处理样品进行了比较。并提出了一种在LTCC厚衬底上制作微通孔和沟槽的方法。对于254 μ m厚的绿色带，直径和间隔为50 μ m的通孔沿着具有小至30 μ m宽度的沟槽实现。详细介绍了优化激光加工工艺的方法。制作了带阻蘑菇谐振器和微带环形谐振器滤波器，并将其结果与仿真结果进行了比较。
In this paper, a process for direct laser structuring of microwave circuits in low-temperature co-fired ceramic (LTCC) technology is reported. An efficient alternative to screen printing is proposed for prototyping circuits by laser patterning the conductors on the unfired tape. A line width and gap of 50 ¿m are achieved with laser machining. A range of samples has been studied using a scanning electron microscope in order to optimize the process parameters. The surface roughness of laser-treated samples is measured with a surface profiler and compared with the untreated samples. A method of creating microvias and trenches in thick LTCC substrate is also demonstrated. For 254 ¿m thick green tape, vias with a diameter and separation of 50 ¿ m are realized along with trenches having a width as small as 30 ¿m. The method of optimizing the laser machining process is described in detail. A band-stop mushroom resonator and a microstrip ring resonator filter are fabricated and their results compared against simulations.