Development of atmospheric pressure plasma jet etching for trimming of micro-machined devices
Development of atmospheric pressure plasma jet etching for trimming of micro-machined devices
复制标题
用于微加工器件修整的常压等离子射流蚀刻的开发
DOI:
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发表时间:
2022
期刊:
影响因子:
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通讯作者:
Futoshi Iwata
中科院分区:
文献类型:
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作者:
Takeru Tomita ;Kenta Nakazawa;Takahiro Hiraoka;Yuichi Otsuka;Kensuke Nakamura;Futoshi Iwata