LHCb VELO upgrade

LHCb VELO upgrade
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LHCb VELO 升级

DOI:
10.1016/j.nima.2016.04.077
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发表时间:
2017
期刊:
Accelerators, Spectrometers, Detectors and Associated Equipment
影响因子:
--
通讯作者:
Hennessy K
Hennessy K
中科院分区:
--
文献类型:
--
作者:
Hennessy K

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LHCb实验的升级计划于2021年启动,计划用于LHC Run-III,将把实验转变为一个无探测器的系统,以40 MHz的事件率阅读整个探测器。所有数据简化算法将在一个高级软件农场中执行,使探测器能够在2× 1033 cm −2s− 1的光度下运行。顶点探测器(VELO)是围绕相互作用区域的硅顶点探测器。电流检测器将被配备有能够以40 MHz阅读的电子器件的混合像素系统所取代。升级后的VELO将为软件触发器提供快速模式识别和轨迹重建。硅像素传感器的间距为55×55 μ m2,由Timepix/Medipix系列的VeloPix ASIC读出。最热区域的像素命中率为900 Mhits/s,升级后的VELO的总数据速率超过3 Tbit/s。探测器模块位于单独的真空中,通过薄的定制箔与束真空分开。箔将通过铣削加工,并可能通过化学蚀刻进一步减薄。通过使用在400 μm厚的硅衬底内的微通道中循环的蒸发CO2冷却剂,将材料预算降至最低。描述了VELO升级的现状,并介绍了辐照传感器组件运行的最新结果。
The upgrade of the LHCb experiment, scheduled for LHC Run-III, scheduled to start in 2021, will transform the experiment to a trigger-less system reading out the full detector at 40 MHz event rate. All data reduction algorithms will be executed in a high-level software farm enabling the detector to run at luminosities of 2×1033cm−2s−1.The Vertex Locator (VELO) is the silicon vertex detector surrounding the interaction region. The current detector will be replaced with a hybrid pixel system equipped with electronics capable of reading out at 40 MHz. The upgraded VELO will provide fast pattern recognition and track reconstruction to the software trigger. The silicon pixel sensors have 55×55 μm2pitch, and are read out by the VeloPix ASIC, from the Timepix/Medipix family. The hottest region will have pixel hit rates of 900 Mhits/s yielding a total data rate of more than 3 Tbit/s for the upgraded VELO. The detector modules are located in a separate vacuum, separated from the beam vacuum by a thin custom made foil. The foil will be manufactured through milling and possibly thinned further by chemical etching.The material budget will be minimised by the use of evaporative CO2coolant circulating in microchannels within 400 μm thick silicon substrates. The current status of the VELO upgrade is described and latest results from operation of irradiated sensor assemblies are presented.