Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining
Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining
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DOI：
10.1016/j.ijmachtools.2003.12.006
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发表时间：
2004-05
影响因子：
14
通讯作者：
L. Yin;E. Vancoille;K. Ramesh;Han Huang
中科院分区：
文献类型：
--
作者：
L. Yin;E. Vancoille;K. Ramesh;Han Huang
对压痕和研磨加工中的 6H-SiC (0001) 基材进行表面表征，以研究与材料去除和表面生成相关的微裂纹、残余损伤和表面粗糙度。使用维氏压痕和纳米压痕研究了脆性与塑性变形。为了表征磨料加工响应，使用粒度为 25、15 和 7 μm 的金刚石砂轮研磨 6H-SiC (0001) 基材，然后使用 3 和 0.05 μm 的金刚石悬浮液进行抛光。研究发现，在压痕中，6H-SiC 基底的脆性变形与塑性变形存在尺度效应。此外，在磨削中，随着金刚石磨粒尺寸的减小，基底的断裂尺度和表面粗糙度也随之减小。然而，在抛光过程中，金刚石悬浮液粒度的减小并没有显着改善表面粗糙度。此外，结果表明，抛光过程中产生了无断裂的6H-SiC（0001）表面，并存在残余晶体缺陷，这与单晶生长缺陷的起源有关。
Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining was carried out to investigate microfracture, residual damage, and surface roughness associated with material removal and surface generation. Brittle versus plastic deformation was studied using Vickers indention and nano-indentation. To characterize the abrasive machining response, the 6H-SiC (0001) substrates were ground using diamond wheels with grit sizes of 25, 15 and 7 μm, and then polished with diamond suspensions of 3 and 0.05 μm. It is found that in indentation, there was a scale effect for brittle versus plastic deformation in 6H-SiC substrates. Also, in grinding, the scales of fracture and surface roughness of the substrates decreased with a decrease in diamond grit size. However, in polishing, a reduction in grit size of diamond suspensions gave no significant improvement in surface roughness. Furthermore, the results showed that fracture-free 6H-SiC (0001) surfaces were generated in polishing with the existence of the residual crystal defects, which were associated with the origin of defects in single crystal growth.