Electronic and geometric structure of the copper-ceria interface on Cu/CeO2 catalysts
Electronic and geometric structure of the copper-ceria interface on Cu/CeO2 catalysts
复制标题
Cu/CeO2 催化剂上铜-二氧化铈界面的电子和几何结构
DOI:
10.1016/s1872-2067(20)63540-9
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发表时间:
2020-06
影响因子:
16.5
通讯作者:
Wenjie Shen
中科院分区:
文献类型:
--
作者:
Yan Zhou;Aling Chen;Jing Ning;Wenjie Shen
The atomic structure of the active sites in Cu/CeO2catalysts is intimately associated with the copper-ceria interaction. Both the shape of ceria and the loading of copper affect the chemical bonding of copper species on ceria surfaces and the electronic and geometric character of the relevant interfaces. Nanostructured ceria, including particles (polyhedra), rods, and cubes, provides anchoring sites for the copper species. The atomic arrangements and chemical properties of the (111), (110) and (100) facets, preferentially exposed depending on the shape of ceria, govern the copper-ceria interactions and in turn determine their catalytic properties. Also, the metal loading significantly influences the dispersion of copper species on ceria with a specific shape, forming copper layers, clusters, and nanoparticles. Lower copper contents result in copper monolayers and/or bilayers while higher copper loadings lead to multi-layered clusters and faceted particles. The active sites are usually generated via interactions between the copper atoms in the metal species and the oxygen vacancies on ceria, which is closely linked to the number and density of surface oxygen vacancies dominated by the shape of ceria.
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影响因子:
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作者:
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通讯作者:
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影响因子:
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DOI:
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期刊:
Catal. Sci. Technol
影响因子:
--
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通讯作者:
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