Improved simulation of phase change processes in applications where conduction is the dominant heat transfer mode

Improved simulation of phase change processes in applications where conduction is the dominant heat transfer mode
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改进了传导为主要传热模式的应用中相变过程的模拟

DOI:
10.1016/j.enbuild.2011.12.008
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发表时间:
2012
影响因子:
6.7
通讯作者:
Gowreesunker B
Gowreesunker B
中科院分区:
工程技术2区
文献类型:
--
作者:
Gowreesunker B

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本文报道了相变材料(PCM)相变过程半经验模型的开发、实验验证和应用。PCM现在越来越多地用于各种建筑材料,如石膏板,混凝土或面板,以改善建筑物的热控制,其行为的准确建模对于有效地捕获存储对室内热条件的影响非常重要。与许多商业模拟软件包,假设非常相似的熔融和凝固行为的PCM和没有滞后,所采用的方法分别对待的熔融和凝固过程,这使得包括滞后的影响,在建模。如本文中的结果所示,该方法提供了材料中的温度和热流的更准确的预测,这对于在热循环期间提供室内热条件的准确表示特别重要。这两种方法的预测精度的差异是PCM的属性的函数。PCM的滞后越小,传统方法的预测误差越低,并且求解时间将成为实际应用中选择模拟方法的决定性因素。
This paper reports on the development, experimental validation and application of a semi-empirical model for the simulation of the phase change process in phase change materials (PCM). PCMs are now increasingly being used in various building materials such as plasterboard, concrete or panels to improve thermal control in buildings and accurate modelling of their behaviour is important to effectively capture the effects of storage on indoor thermal conditions. Unlike many commercial simulation packages that assume very similar melting and freezing behaviour for the PCM and no hysteresis, the methodology employed treats the melting and freezing processes separately and this allows the inclusion of the effect of hysteresis in the modelling. As demonstrated by the results in this paper, this approach provides a more accurate prediction of the temperature and heat flow in the material, which is of particular importance in providing accurate representation of indoor thermal conditions during thermal cycling. The difference in the prediction accuracy of the two methods is a function of the properties of the PCM. The smaller the hysteresis of the PCM, the lower will be the prediction error of the conventional approach, and solution time will become the determining factor in selecting the simulation approach in practical applications.
用于办公室冷却的 PCM“帆”原型测试
DOI: 10.1016/j.applthermaleng.2010.10.008
发表时间: 2011
影响因子: 6.4
作者:
G. Susman;Z. Dehouche;Tanawat Cheechern;S. Craig
通讯作者: S. Craig