Diffusion Bonding between Copper-Beryllim Alloy and Stainless Steel.
Diffusion Bonding between Copper-Beryllim Alloy and Stainless Steel.
复制标题
铜铍合金与不锈钢之间的扩散接合。
DOI：
10.2207/qjjws.13.411
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发表时间：
1995
期刊：
影响因子：
--
通讯作者：
Shizuo Mukae
中科院分区：
文献类型：
--
作者：
H. Masumoto;K. Nishio;A. Asaka;M. Katoh;Shizuo Mukae
在真空条件下，对Cu-0.5mass%Be和Cu-2mass%Be的工业铜铍合金与奥氏体不锈钢SUS 304进行了扩散连接。使用Ni箔和Cu箔作为插入金属。研究了键合温度、键合时间和镶块金属对键合性能的影响。研究了人工时效对接头强度的影响。结果表明：（1）Cu-0.5mass %Be和Cu-2 mass%Be合金的连接温度与固相线温度之比Tg/TSL分别小于0.78和0.82时，铜铍合金与不锈钢的直接连接是不可能的。但随着比值的增大，接头强度急剧增加。(2)在830°C× 3.6ks的连接条件下，铜箔连接接头的连接强度比直接连接接头高100 MPa左右。Cu-0.5mass%Be合金与带Ni箔的SUS 304接头的拉伸断裂发生在铜合金母材上。但是，Cu-2质量%Be合金与SUS 304的Ni箔接合时，由于在铜合金与Ni箔之间的扩散层中产生空隙，因此接合强度与直接接合时相同。(3)Cu-0.5mass%Be合金与SUS 304合金的接头在有Cu箔或无镶嵌金属的条件下时效后，接头强度均高于未时效时的接头强度，但有Ni箔的接头强度更高，达到540 MPa。Cu-2 mass%Be合金与SUS 304合金的直接连接在固溶热处理过程中虽然在连接界面处发生断裂，但带铜箔的接头强度较高，达到520 MPa。
Diffusion bondings of commercial copper-beryllium alloys of Cu-0.5 mass%Be and Cu-2 mass%Be alloys to an austenitic stainless steel SUS304 were carried out in a vacuum. Ni foil and Cu foil were used as an insert metal. Influences of the bonding conditions of bonding temperature, bonding time and the insert metal on the bondability have been investigated. And also an effect of artificial agings on the joint strength of the joints has been studied. Main results obtained are as follows;(1) On the direct bonding of copper-beryllium alloy to stainless steel, bonding was impossible when the ratio of bonding temperature to solidus temperatures of Cu-0.5 mass%Be and Cu-2 mass%Be alloys Tg/TSLwas less than 0.78 and 0.82, respectively. However, the joint strength increased abruptly with rising the ratio.(2) The joint strength of the joints with Cu foil was higher by about 100 MPa than that of the direct bonds at the bonding condition of 830°C×3.6 ks. The tensile fracture of the joint of Cu-0.5 mass%Be alloy to SUS304 with Ni foil was occurred in the copper alloy base metal. However, the joint strength of the joint of Cu-2 mass%Be alloy to SUS304 with Ni foil was the same value as that of the direct bond because of development of voids in the diffusion layer between the copper alloy and Ni foil.(3) When the joint of Cu-0.5 mass%Be ally to SUS304 with Cu foil or without the insert metal were aged, the joint strength was higher than that of the as-bonded, but the joint strength of the joint with Ni foil was higher value of 540 MPa. Though the direct bond of Cu-2 mass%Be alloy to SUS304 fractured at the bond interface during solution heat treatment, but the joint strength of the joint with Cu foil was higher value of 520 MPa.