Alternative glues for the production of ATLAS silicon strip modules for the Phase-II upgrade of the ATLAS Inner Detector
Alternative glues for the production of ATLAS silicon strip modules for the Phase-II upgrade of the ATLAS Inner Detector
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DOI：
10.1088/1748-0221/11/05/p05017
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发表时间：
2015-08
影响因子：
1.3
通讯作者：
L. Poley;I. Bloch;S. Edwards;C. Friedrich;I. Gregor;T. Jones;H. Lacker;S. Pyatt;L. Rehnisch;D. Sperlich;J. Wilson
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文献类型：
--
作者：
L. Poley;I. Bloch;S. Edwards;C. Friedrich;I. Gregor;T. Jones;H. Lacker;S. Pyatt;L. Rehnisch;D. Sperlich;J. Wilson
高亮度大型强子对撞机（HL-LHC）ATLAS探测器的第二阶段升级包括用由像素和条带探测器组成的全硅跟踪器取代当前的内部探测器。目前的第二阶段探测器布局需要建造20，000个由传感器、电路板和读出芯片组成的条带探测器模块，这些模块使用粘合剂机械连接。最初在读出芯片和电路板之间使用的粘合剂是银环氧树脂胶，如在当前的ATLAS半导体跟踪器（SCT）中使用的。然而，这种胶水有几个缺点，这促使人们寻找替代品。本文介绍了六种紫外线（UV）固化胶和胶垫的研究，可能用于组装硅条探测器模块的ATLAS升级。进行了试验，以确定易用性，热传导和剪切强度。对试样进行热循环，测定了试样的辐射硬度和耐腐蚀性。这些研究导致排除了三种UV固化胶以及胶垫。发现三种UV固化胶可能是比载银胶更好的替代品。使用这些胶水建造的第一个原型模块的电气测试结果。
The Phase-II upgrade of the ATLAS detector for the High Luminosity Large Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector with an all-silicon tracker consisting of pixel and strip detectors. The current Phase-II detector layout requires the construction of 20,000 strip detector modules consisting of sensor, circuit boards and readout chips, which are connected mechanically using adhesives. The adhesive used initially between readout chips and circuit board is a silver epoxy glue as was used in the current ATLAS SemiConductor Tracker (SCT). However, this glue has several disadvantages, which motivated the search for an alternative. This paper presents a study of six ultra-violet (UV) cure glues and a glue pad for possible use in the assembly of silicon strip detector modules for the ATLAS upgrade. Trials were carried out to determine the ease of use, thermal conduction and shear strength. Samples were thermally cycled, radiation hardness and corrosion resistance were also determined. These investigations led to the exclusion of three UV cure glues as well as the glue pad. Three UV cure glues were found to be possible better alternatives than silver loaded glue. Results from electrical tests of first prototype modules constructed using these glues are presented.