Giant magnetoresistance in electrodeposited Ni-Cu/Cu multilayers and anisotropic magnetoresistance in pulse-plated NixCu1−x alloy films

Giant magnetoresistance in electrodeposited Ni-Cu/Cu multilayers and anisotropic magnetoresistance in pulse-plated NixCu1−x alloy films
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电沉积 Ni-Cu/Cu 多层膜中的巨磁阻和脉冲电镀 NixCu1−x 合金薄膜中的各向异性磁阻

DOI:
10.1007/s10008-003-0422-8
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发表时间:
2004
影响因子:
2.5
通讯作者:
W. Schwarzacher
W. Schwarzacher
中科院分区:
工程技术4区
文献类型:
--
作者:
I. Kazeminezhad;W. Schwarzacher

文献摘要

被引文献

相似文献

采用氨基磺酸盐电解液在镀金玻璃上电沉积Ni-Cu/Cu多层膜和NixCu 1 − x合金薄膜。研究了多层膜的室温磁电阻随铁磁Ni-Cu层厚度的变化。观察到巨磁电阻,其峰值在约1%的Ni-Cu层厚度约15埃。在室温和77 K下测量了不同成分的NixCu 1 − x薄膜的磁电阻。在室温和77 K下分别观察到高达1.1%和1.7%的各向异性磁电阻。
Ni-Cu/Cu multilayers and NixCu1−xalloy films were electrodeposited on Au-coated glass substrates from a sulfamate-based electrolyte. The room-temperature magnetoresistance of the multilayers was studied as a function of the ferromagnetic Ni-Cu layer thickness. Giant magnetoresistance was observed, which peaked at about 1% for a Ni-Cu layer thickness around 15 Å. Magnetoresistance measurements of NixCu1−xfilms of different composition were obtained at both room temperature and 77 K. Anisotropic magnetoresistance of up to 1.1% and 1.7% was observed at room temperature and 77 K, respectively.