Direct electroplating of copper on tantalum from ionic liquids in high vacuum: origin of the tantalum oxide layer.
Direct electroplating of copper on tantalum from ionic liquids in high vacuum: origin of the tantalum oxide layer.
复制标题
高真空下离子液体在钽上直接电镀铜：氧化钽层的起源。
DOI：
10.1039/c2cp41786c
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发表时间：
2012
期刊：
影响因子：
--
通讯作者：
J. Fransaer
中科院分区：
文献类型：
--
作者：
Stijn Schaltin;L. D'urzo;Qiang Zhao;A. Vantomme;H. Plank;G. Kothleitner;C. Gspan;K. Binnemans;J. Fransaer
在本文中，它表明，高真空条件是不足以完全从离子液体1-乙基-3-甲基咪唑氯化物中除去水和氧。如核反应分析（NRA）所证明的，完全去除水需要在减压下加热到150 °C以上。溶解的氧气只能通过使用氧清除剂如对苯二酚来去除，尽管计算表明氧气应该通过所施加的真空条件完全去除。在应用严格的干燥程序和清除分子氧之后，可以直接在钽上存款铜而不存在中间氧化物层。
In this paper, it is shown that high vacuum conditions are not sufficient to completely remove water and oxygen from the ionic liquid 1-ethyl-3-methylimidazolium chloride. Complete removal of water demands heating above 150 °C under reduced pressure, as proven by Nuclear Reaction Analysis (NRA). Dissolved oxygen gas can only be removed by the use of an oxygen scavenger such as hydroquinone, despite the fact that calculations show that oxygen should be removed completely by the applied vacuum conditions. After applying a strict drying procedure and scavenging of molecular oxygen, it was possible to deposit copper directly on tantalum without the presence of an intervening oxide layer.
影响因子：
4.9
作者：
Md. Mominul Islam;T. Okajima;Shimpei Kojima;T. Ohsaka
通讯作者：
Md. Mominul Islam;T. Okajima;Shimpei Kojima;T. Ohsaka
影响因子：
3.9
作者：
Katayama, Y;Sekiguchi, K;Miura, T
通讯作者：
Miura, T