Toughness measurement of thin films: a critical review
Toughness measurement of thin films: a critical review
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DOI：
10.1016/j.surfcoat.2004.10.021
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发表时间：
2005-08
影响因子：
5.4
通讯作者：
Sam Zhang;Deen Sun;Y. Fu;H. Du
中科院分区：
文献类型：
--
作者：
Sam Zhang;Deen Sun;Y. Fu;H. Du
目前，没有标准的测试程序，也没有标准的方法来评估薄膜的韧性。然而，研究人员长期以来一直试图进行这种测量，因此已经开发了一系列测试方法，大多数都以自己的方式进行。作为定性或半定量评估，简单的塑性测量或划痕附着力测试基本上就足够了。然而，为了定量描述，必须选择弯曲、屈曲、压痕、划痕或拉伸试验。这些测试方法是基于压力或基于能量的。本文对这些方法进行了评述，并得出结论，对于薄膜，基于能量的方法，特别是与衬底无关的方法，更有优势。
At present, there is neither standard test procedure nor standard methodology for assessment of toughness of thin films. However, researchers have long been trying to make such measurements, thus a spectrum of test methods have been developed, mostly each in its own way. As qualitative or semiquantitative assessment, a simple plasticity measurement or scratch adhesion test can mostly suffice. For quantitative description, however, a choice of bending, buckling, indentation, scratching, or tensile test has to be made. These testing methods are either stress-based or energy-based. This paper gives a critical review on these methods and concludes that, for thin films, the energy-based approach, especially the one independent of substrate, is more advantageous.