Hybrid integration of quantum dot-nanocavity systems on silicon

Hybrid integration of quantum dot-nanocavity systems on silicon
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DOI:
10.1364/fio.2019.fm3d.4
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发表时间:
2019-09
期刊:
Frontiers in Optics + Laser Science APS/DLS
影响因子:
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通讯作者:
Y. Ota;R. Katsumi;A. Osada;M. Kakuda;S. Iwamoto;Y. Arakawa
Y. Ota;R. Katsumi;A. Osada;M. Kakuda;S. Iwamoto;Y. Arakawa
中科院分区:
其他
文献类型:
--
作者:
Y. Ota;R. Katsumi;A. Osada;M. Kakuda;S. Iwamoto;Y. Arakawa

文献摘要

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我们讨论了一种用于硅上混合集成的转移印刷方法。该技术简化了 CMOS 处理电路上纳米腔中 III-V 量子点的集成过程,从而实现了硅上的单光子源和腔 QED 系统。
We discuss a transfer printing method for on-silicon hybrid integration. This technique simplifies the integration process of III-V quantum dots in nanocavities on CMOS-processed circuits, enabling single photon sources and cavity QED systems on Si.